National Yang Ming Chiao Tung University

Compound Semiconductor Device Research Center

Dr. Edward Yi Chang
https://csdlab.web.nycu.edu.tw/

Research Field

Materials Engineering

Introduction

Edward Y. Chang received his B.S. degree from Materials Science and Engineering, National Tsing Hua University, Hsinchu, Taiwan in 1977, and his Ph.D. degree from Materials Science and Engineering, University of Minnesota Minneapolis, MN in 1985. 

Dr. Chang was with Unisys Corporation GaAs Component Group, Eagan, MN, 1985 to 1988 and Comsat Labs Microelectronic Group from 1988 to 1992. He worked on the GaAs MMIC programs on both groups. He joined National Chiao Tung University, Hsinchu, Taiwan, in 1992. In 1994, he helped set up the first GaAs MMIC production line in Taiwan, and become president of Hexawave Inc., Hsinchu, Taiwan, in 1995. He returned to the teaching position at NCTU in 1999, and is currently the Associate Dean of Industry Academia Innovation School and Chair Professor of the Departments of Materials Science and Engineering and Electronics Engineering at NYCU. 

Our Missions

  • Cultivation of international talents.
  • Industry-academia partnerships.
  • Innovative research of social impacts.
  • Advancing power and RF electronics via III-V and III-nitride device and materials research.
  • Platform for the integrated III-V  technology development for industry from materials, device , process, equipment, package, testing up to pilot line production.

 

Research Areas
 

  • GaN power devices for EV and PV
  • GaN device for 5G and beyond technology
  • Novel compound semiconductor epitaxy
  • III-V Finfet for logic Applications
  • GaN device for satellite communication
  • Solar UAV


Research Topics

•    InP, GaAs based compound materials and devices (HEMT, HBT) for wireless communication and sub-milimeterwave imaging applications
•    GaN based materials (MBE, MOCVD) and High frequency & High power electronics (HEMT) applications
•    III-V/ Si integration (Ge, SiGe, GaAs, InP) for logic applications
•    Advanced package (Flip chip) for high frequency and power applications


Honor
  • 2019 IEEE Life Fellow
  • 2019 JSAP Fellow International (Japan Society of Applied Physics)
  • 2013 The Materials Research Society-Taiwan(MRS-T) Fellow
  • 2025 Annual Outstanding Research Fellow of National Science and Technology Council 
  • 2022 The Ministry of Education’s 66th Annual Academic Awards
  • 2021 Excellence in Technology Transfer Award, Ministry of Science and Technology, Taiwan
  • 2011 Outstanding Technology Transfer Contribution Award
  • 2008 Outstanding Electrical Engineering Professor Award
     

Educational Background

•    Ph.D. in Materials Science and Engineering, University of Minnesota, USA
•    B.S. Department of Materials Science and Engineering, National Taiwan Tsinghua University, Taiwan