Interface Chemistry & Semiconductor Materials Lab
Research Field
Dr. Chien-Pang Liu received his Ph.D. in Microelectronics Engineering from National Cheng Kung University (NCKU), Taiwan, in 2019. His doctoral research focused on wide-bandgap semiconductor materials and advanced process technologies. After completing his Ph.D., he joined the NanoSystems Institute at the University of California, Los Angeles (UCLA) as a visiting scholar, conducting research on gallium nitride (GaN) and related compound semiconductors for applications in optoelectronic and electronic devices.
From 2009 to 2022, Dr. Liu accumulated over a decade of experience in the semiconductor industry, working at Texas Instruments and Micron Technology. He served as a Process Integration Device Manager, specializing in advanced process development, reliability analysis, and global technology transfer. His expertise includes wide-bandgap semiconductors (GaN, AlGaN), optoelectronic semiconductors, advanced semiconductor processes and packaging, reliability analysis, and materials development. In recent years, his research has focused on GaN on Si, deep ultraviolet AlGaN LEDs, reliability analysis of GaN HEMT high electron mobility transistors, flexible micro-LEDs (μ-ILED), high-power GaN devices, next-generation memory technologies (including EUV process integration and 1γ-node HKMG CMOS innovations), as well as analysis and application development of metal wire bonding technologies.
In August 2025, Dr. Liu joined the Department of Chemical and Materials Engineering at Tunghai University as an Assistant Professor. He is dedicated to advancing teaching and research in semiconductor materials and advanced process integration. His representative research has been published in Journal of Materials Processing Technology and Journal of Alloys and Compounds, and he is the inventor of U.S. Patent US20230233068A1 (2023).
We seek to understand and advance the performance and reliability of semiconductor systems by integrating knowledge across materials science, electrical engineering, and optical-mechanical systems. Our research encompasses a broad spectrum of topics, including semiconductor reliability and materials innovation, microelectronic 3D packaging, and device physics. We are particularly interested in polymer-based nanocomposites for packaging applications, molecular design of crosslinked polymer electrolytes for solid-state lithium batteries, and conductive supramolecular hydrogels for biomedical platforms.
Our goal is to bridge the gap between material-level design and system-level reliability, employing a multidisciplinary approach that draws upon optical, electrical, and materials-based analysis. These efforts extend to device failure analysis and reliability testing, enabling a deeper understanding of degradation mechanisms and performance limitations in real-world applications. We also explore opto-mechanical-electrical integration for advanced electronic systems.
By maintaining close collaborations with industry partners, we ensure our research remains application-driven and capable of contributing directly to technological advancements in both industrial and academic domains. This dynamic, feedback-oriented research strategy allows us to stay at the forefront of semiconductor innovation and to train researchers equipped to tackle challenges across disciplines.
1. New materials of wire-bonding/wedge-bonding technology in IC and optoelectronics packaging
Cu wire has already replaced Au wire and will dominate the next few years of nanoscale semiconductor packaging industry in higher pin counts of
semiconductor packages and ultra-fine pitch low-k, and extra-low-k device dielectrics, stacked dies in nanoscale device packaging especially in LED and
RF application, more work need to be done to meet the reliability requirements and make bonding process withstand advanced processing. Different
material wire investigations are necessary (eg., Ag, Al and Pd coated wire) as well as research their feasibility in different application area in advanced IC
and optoelectronics packaging.
2. Thermal & humidity induced degradation in μLEDs system (GaN device) as well as its life prediction
The μLED system have been spotlighted for future display and biomedical devices, such as biosensors, plus oximetry (SpO2) sensors, and optogenetic
stimulators. It encompassed different materials and structure fabrication in μLED and array. Extrapolation of the test data at accelerated stress condition
to normal condition is challenging because the degradation mechanisms of μLEDs or GaNdeviece under humidity is changing with different humidity level
and temperature. In view of the different degradation mechanisms at various operating conditions, qualification of these devices should be depending on
their application environments. No standard qualification procedure can be established for all applications. The design of appropriate qualification
procedures will be a future challenge. Besides, I would also improve modeling for life prediction of μLED devices which is based on modified TM-21
extrapolation using LM-80 data. Also, I would design the reliability test vehicle and their method studies/test condition setup regarding sensitivity to
failure mechanism ( DC/AC/RF ).
3. Bio-integrated flexible sensing systems
The fabricated sensor would also have the sensor arrays, in the next stage, portable wireless/bluetooth monitor which act as a next generation electronic
assay kit for speedy multi-analyte detection as a well-furnished portable standalone diagnostic device.
4. Nanomaterials on dentinal tubule occlusion
Dental diseases such as dentin hypersensitivity (causing sharp pain and anxiety), caries, and pulp inflammation. My previous research was to develop a
fast-reacting, more reliable and biocompatible biomaterial that effectively occludes exposed dentinal tubules by forming a biomimetic crystalline dentin
barrier. To generate this biomaterial, a gelatin-templated mesoporous silica biomaterial (CaCO3@mesoporous silica, CCMS) containing nanosized
calcium carbonate particles is mixed with 30% H3PO4 at a 1/1 molar ratio of Ca/P (denoted as CCMS-HP), which enables Ca2+ and PO43-/HPO4 2-
ions to permeate the dentinal tubules and form dicalcium phosphate dihydrate (DCPD), tricalcium phosphate (TCP) or hydroxyapatite (HAp) crystals at a
depth of approximately 40 μm. Besides, currently, I have also tackled with the researched paper about the various ions for its mechanisms of Ion
Permeability and Selectivity Study in Dentinal Tubules.
In the near future, team would start to develop self-assembled peptide hydrogels for tissue regeneration with excellent biocompatibility, tunable
mechanical stability, injectability. Peptide-based hydrogels are ideal templates for the deposition of hydroxyapatite (HA) crystals, which can mimic the
extracellular matrix. Thus, peptide-based hydrogels enhance hard tissue repair and regeneration compared to conventional methods.
The self-assembled hydrogels are simply produced with a molecular self-assembly process. Molecular self-assembly is a spontaneous process in which
the molecules assemble into a stable structure via non-covalent interactions, such as hydrogen bonding, electrostatic interactions, π–π stacking, and
hydrophobic interactions. It is indeed a bottom-up approach and a powerful technique for producing novel nanostructures and biomaterials.
2010 Best Technical Presentation, Texas Instruments Engineering Conference, Dallas, USA
2014 Outstanding Contributor Award Nominee, Hangzhou, China
2023 Micron Culture Champion
2024 Micron Bravo Point
2024 Micron Medal Award
2025 Micron 12 Discipline Award
2025 Tunghai University 2025 Academic Year New Faculty Research Award
Ph.D., Department of Microelectronics Engineering, National Cheng Kung University, Taiwan
M.S., Department of Chemical Engineering, National Taiwan University, Taiwan
B.S., Department of Chemical Engineering, National Cheng Kung University, Taiwan
Job Description
As part of Dr. Chien-Pang Liu's lab at Tunghai University, interns will engage in multidisciplinary research aimed at enhancing the performance and reliability of semiconductor systems. Key project areas include:
- Investigating new materials for wire-bonding and wedge-bonding in IC and optoelectronic packaging, such as Ag, Al, and Pd-coated wires, to improve reliability in nanoscale devices.
- Studying thermal and humidity-induced degradation in μLED systems (GaN-based), developing life prediction models using modified TM-21 extrapolation and LM-80 data, and designing application-specific reliability test vehicles.
- Developing bio-integrated flexible sensing systems, including sensor arrays with wireless/Bluetooth monitoring for multi-analyte detection in diagnostic devices.
- Exploring nanomaterials for dentinal tubule occlusion and self-assembled peptide hydrogels for tissue regeneration, focusing on biocompatibility, ion permeability, and biomimetic crystal formation. Interns will participate in experimental setups, data collection (e.g., reliability testing under DC/AC/RF conditions), simulation modeling, and collaborative discussions with industry partners. This role emphasizes a feedback-oriented approach to innovation, preparing interns for careers in semiconductor R&D, materials engineering, or biomedical technologies. No prior industry experience is required, but enthusiasm for hands-on research is essential.
Preferred Intern Educational Level
Bachelor's or Master's or PhD students in Chemical Engineering, Materials Science, Electrical Engineering, Microelectronics, or related fields. Advanced undergraduate students (juniors or seniors) with strong academic records and relevant coursework may also be considered.
Skill sets or Qualities
- Strong foundation in materials science, semiconductor physics, or electrochemistry.
- Familiarity with laboratory techniques such as reliability testing, materials characterization (e.g., SEM, XRD), or process simulation.
- Proficiency in data analysis tools (e.g., Python, MATLAB, FDT) for modeling degradation mechanisms or lifetime predictions.
- Excellent analytical and problem-solving skills, with attention to detail in experimental work.
- Effective communication and teamwork abilities for interdisciplinary collaboration.
- Curiosity, adaptability, and a passion for bridging fundamental research with practical applications.
- Basic knowledge of semiconductor devices or polymer nanocomposites or material composites is a plus, but not required.