Advanced Materials and Electronics Laboratory
Research Field
Hello, I'm Dr. Chia-Hua Lin.
I'm an Assistant Professor in the Department of Materials Science and Engineering at Tunghai University.
My research bridges materials chemistry, electronic packaging, and interface engineering, with a focus on developing high-performance and reliable interconnect materials for next-generation semiconductor technologies. He has extensive experience in seed layer development, Cu-Cu direct bonding, and integration of nanomaterials into sensing and energy applications.
I'm actively collaborates with industry and research institutes to transform fundamental material innovation into real-world solutions.
Advanced Materials and Electronics Laboratory is dedicated to the interdisciplinary research of materials innovation and device integration. Our mission is to develop robust materials platforms for semiconductor packaging, interconnect reliability, and intelligent sensing systems.
By integrating materials synthesis, surface/interface modification, and multiscale analysis—including thermal, mechanical, and electrochemical characterization—we aim to provide cutting-edge solutions for electronics, energy, and environmental applications.
Our team emphasizes hands-on training, collaborative research, and international engagement.
- Seed Layer & Interface Engineering
- Low-Temperature Sintering of Nanoparticles
- Metal-TCPP-Based Sensing and Separation
- Negative Thermal Expansion (NTE) Materials
- AI-Assisted Reliability Simulation
- Recipient of the Ministry of Science and Technology (MOST) Young Scholar Research Grant
- Two-time Recipient of the Micron Culture Champion Award
- Invited Keynote Speaker, Future Materials 2026 (Singapore)
- Postdoctoral Research Fellow, National Chiao Tung University
- Diffusion Process Engineer, Micron Technology
- R&D Engineer, VisEra Technologies
- Ph.D., Chemical and Materials Engineering, National Central University, Taiwan
- B.S., Chemical and Materials Engineering,Tunghai University,Taiwan
Job Description
This opportunity is ideal for undergraduate or master’s students interested in materials science, surface engineering, or semiconductor packaging.
Preferred Intern Education Level
[For Master/Undergraduate Students] Engineering Internship
Skill sets or Qualities
- Material Property Characterization and Experimental Data Analysis
- Ability to analyze and organize experimental data using Excel or Origin
- Teamwork and collaboration ability
Job Description
Suitable for students interested in inorganic synthesis, sensing technology, or packaging reliability.
Preferred Intern Education Level
[For PhD/Master] Engineering Internship
Skill sets or Qualities
- Basic knowledge of materials science or physical chemistry
- Familiarity with thin film characterization techniques (e.g., SEM, XRD, Raman)